Striker conformal TSV dielectric liners

Lam Research · Packaging processes and engineering validation

Purpose: TSV leakage assessment requires comparison of depth-dependent liner coverage and dielectric properties, not nominal thickness alone.
Technical approach: Striker deposits conformal dielectric films by layer-by-layer ALD with application-specific process, chemistry and hardware options.
Scope of use: The supplier connects ALD with next-generation TSV oxide liners. Confirm geometry, exposed materials and thermal budget for the selected configuration.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Conformality does not guarantee defect-free films or leakage limits. Sidewall/bottom thickness, interfaces and downstream steps need independent checks.
What to prepare
BLNKK suggests TSV geometry/materials, thermal history, target thickness, depth cross-sections and electrical controls measured before breakdown.
Confirm with the supplier
Confirm model/film chemistry, coverage/defect metrology, thermal budget, downstream compatibility and sample validation.
Public evidence: The product body describes conformal liners; a dated 2025 HBM explainer supplies TSV/Striker context.

Supporting references

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