SABRE 3D electrochemical deposition for advanced packaging
Addresses voids, thickness uniformity and within-die coplanarity in TSV filling and packaging-interconnect plating.
Lam Research
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View contact information ↓Public capability summary
- Deposition · etch · clean and advanced packaging process equipment
Applications: TSV, RDL, copper pillars, microbumps and HDFO · HBM / interposer TSV formation · Wafer-bonding bevel processes · TSV dielectric-liner processes
Catalog solutions · 4
Syndion deep-silicon TSV etching
Evaluate TSV depth, sidewalls and scallops before downstream liner, seed and copper-fill development.
Coronus wafer-bevel residue and protection
Bonding abnormalities with evidence of edge contamination need comparisons of residues and bevel protection.
Striker conformal TSV dielectric liners
TSV leakage assessment requires comparison of depth-dependent liner coverage and dielectric properties, not nominal thickness alone.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- Coronus wafer-bevel residue and protection · Local interface voids after hybrid bonding →
- Syndion deep-silicon TSV etching · Seams and voids in TSV copper fill →
- SABRE 3D electrochemical deposition for advanced packaging · Seams and voids in TSV copper fill →
- Striker conformal TSV dielectric liners · Leakage localization in TSV insulating liners →
Public sources
- Product information: SABRE 3D electrochemical deposition for advanced packaging
- Technical reference: SABRE 3D: Powering the Next Era of Advanced Packaging (July 21, 2026)
- Product information: Syndion deep-silicon TSV etching
- Product information: Coronus wafer-bevel residue and protection
- Product information: Striker conformal TSV dielectric liners
Contact information
Contact the supplier directly through its official channels.
United States · Headquarters · Sales inquiries
Lam Research Corporation — Fremont Headquarters / Business and Sales
- Phone
- +1 510 572 0200
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Taiwan · Supplier office
Lam Research — Hsinchu Office (TWN-26)
- Phone
- +886 3 688 3666
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Mainland China · Supplier office
Lam Research — Shanghai Office (CHN-16)
- Phone
- +86 21 2037 1500
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