SABRE 3D electrochemical deposition for advanced packaging

Lam Research · Process equipment and thermal control

Purpose: Addresses voids, thickness uniformity and within-die coplanarity in TSV filling and packaging-interconnect plating.
Technical approach: A modular ECD platform combines plating and pre/post-treatment cells with Electrofill processing for copper and other interconnect metals.
Scope of use: Applications include TSV, RDL, copper pillars, UBM and bumps; metals and modules depend on the process configuration.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Supplier-stated void-free filling is not a guarantee for every geometry. Uniform plating does not exclude seed defects or guarantee low package warpage.
What to prepare
BLNKK suggests TSV/seed data, prewet conditions, chemistry/current settings, cross-sections and wafer-level fill maps.
Confirm with the supplier
Confirm geometry-specific fill windows, seed/wetting prerequisites, defect assessment and post-plating configuration.
Public evidence: The product page lists TSV, RDL and bump applications and uniformity goals; the July 2026 article discusses high-aspect-ratio fill. These are supplier capability descriptions, not void-free qualification results for a customer geometry or material stack.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.