V310i 3D package solder-deposit measurement

ViTrox Corporation Berhad · Packaging processes and engineering validation

Purpose: Post-reflow flip-chip bridging studies need baseline measurements of incoming solder amount, position and distribution.
Technical approach: V310i uses phase-shift profilometry to reconstruct exposed deposits, inspecting height, area, volume, offsets and deposit bridges.
Scope of use: The named body includes printed/dispensed micro-bumps, fine-pitch and SiP/WLP applications. Validate actual surfaces and carriers.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Exposed deposits do not establish buried-joint condition or post-reflow bridge causes. Reflection, shadows and sidewalls can affect reconstruction.
What to prepare
BLNKK suggests real deposits, pad/reference data, regions of interest and matched post-reflow results to evaluate repeatability.
Confirm with the supplier
Confirm optics/platform configuration, calibration/repeatability, volume/boundary algorithms and exported coordinate/geometry data.
Public evidence: The V310i packaging section describes the method and inspection functions separately from V310Ai platforms.

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