V810Ai hidden-joint 3D X-ray inspection
Locate suspected BGA head-in-pillow joints for same-location cross-section/electrical correlation.
ViTrox Corporation Berhad
Explore the supplier’s public information and its documented technical solutions.
View contact information ↓Public capability summary
- Whole optical deposit-metrology and hidden-joint X-ray inspection systems.
Other names: ViTrox
Applications: BGA and flip-chip joint localization · Flip-chip and microbump solder supply
Catalog solutions · 2
V310i 3D package solder-deposit measurement
Post-reflow flip-chip bridging studies need baseline measurements of incoming solder amount, position and distribution.
Candidates in engineering problem guides
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Public sources
Contact information
Contact the supplier directly through its official channels.
For V810Ai X-ray inspection or V310i solder-paste inspection, select AXI or SPI in the supplier form. Taiwan contacts are supplier-listed distributors; confirm coverage for the required model. The Suzhou phone provides general routing. Official source ↗
United States · Supplier office
ViTrox Americas Inc. — Hutto
- Phone
- +1 510 770 6344
Official source ↗Source checked
Taiwan · Supplier-listed distributor · Sales inquiries
LinkWays Tech Co., Ltd. — Taoyuan
- sales@mylinkways.com
- Phone
- +886 3 464 3717
Official source ↗Source checked
Mainland China · Supplier office
ViTrox Technologies (Suzhou) Co., Ltd. — Suzhou
- Phone
- +86 512 6251 9891
Official source ↗Source checked
More regional contacts (2)
Malaysia · Headquarters
ViTrox Corporation Berhad — Penang
- enquiry@vitrox.com
- Phone
- +60 4 545 9988
Official source ↗Source checked
Taiwan · Supplier-listed distributor
Ming Cheng Integration Technology Co., Ltd. — Hsinchu
- leo@mcitek.com.tw
- Phone
- +886 3 572 1398
Official source ↗Source checked
Contacts are listed in the supplier’s public information. Confirm product responsibility and service coverage with the supplier.
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.