V810Ai hidden-joint 3D X-ray inspection

ViTrox Corporation Berhad · Packaging processes and engineering validation

Purpose: Locate suspected BGA head-in-pillow joints for same-location cross-section/electrical correlation.
Technical approach: V810Ai reconstructs and slices multi-view X-ray data; line-scan and area-scan configurations acquire images differently.
Scope of use: ViTrox lists micro-BGA, flip-chip and multilayer joints; choose the model/configuration for board size, shading, pitch and imaging needs.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
One model’s best resolution is not family-wide. Suspect images establish neither electrical opens nor cause. Validate shading, artifacts, dose and detection limits on samples.
What to prepare
BLNKK suggests preparing board/package stacks, pitch/target layer, suspect coordinates, electrical results, controls, allowable dose for sensitive devices and existing cross-sections.
Confirm with the supplier
Confirm model/scanning/reconstruction, image quality, dose and options. Agree on same-location validation, false-call/escape assessment and delivered images/coordinate records.
Public evidence: Official information lists HiP/reconstruction applications and model-specific specifications, not validated detection on this stack.

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