LX9200 3D X-ray inspection
Unicomp · Measurement and inspection
Research candidate · suitability unconfirmed
Official public page; sample suitability remains unconfirmed.
Research checked: 2026-10-15- Purpose
- Potential engineering use: [BGA head-in-pillow opens] Inspect the unfused ball/paste interface. [Initial die-attach voids and coverage] Compare initial coverage and voids in solder/conductive-adhesive die attach. [3D void topology and thermal risk] Quantify 3D location and shape of existing solder/adhesive voids.
- Technical approach
- Detailed mechanism and process conditions are not documented here. Confirm with the supplier.
- Scope of use
- Potential engineering use: [BGA head-in-pillow opens] Inspect the unfused ball/paste interface. [Initial die-attach voids and coverage] Compare initial coverage and voids in solder/conductive-adhesive die attach. [3D void topology and thermal risk] Quantify 3D location and shape of existing solder/adhesive voids.
- Limitations and open questions
- [BGA head-in-pillow opens] Validate imaging angle and resolution; generic void imaging does not establish head-in-pillow. [Initial die-attach voids and coverage] Restrict to the layer below the die; silver-sinter pores and upper copper clips are separate problems. [3D void topology and thermal risk] Pair CT with thermal tests; sample-dependent resolution cannot yield a universal acceptance percentage. Supplier confirmation of samples, specifications and service availability is required; improvement has not been demonstrated.
- Public evidence
- The official source lists LX9200 3D X-ray inspection.
Supporting references
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
Potential uses by engineering problem
BGA head-in-pillow open joints
Inspect the unfused ball/paste interface.
Validate imaging angle and resolution; generic void imaging does not establish head-in-pillow.
View engineering problem →Initial die-attach voids and incomplete coverage
Compare initial coverage and voids in solder/conductive-adhesive die attach.
Restrict to the layer below the die; silver-sinter pores and upper copper clips are separate problems.
View engineering problem →Why can the same void percentage imply different thermal risks?
Quantify 3D location and shape of existing solder/adhesive voids.
Pair CT with thermal tests; sample-dependent resolution cannot yield a universal acceptance percentage.
View engineering problem →BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.