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Why can the same void percentage imply different thermal risks?

Expected deliverable: Three-dimensional void/location data with traceable resolution and artifacts

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Prepare first: Is the following available: Co-registered 2D/3D images and segmentation uncertainty?

Next missing input: Is the following available: Co-registered 2D/3D images and segmentation uncertainty?

This guidance helps prepare the evaluation. Confirm solution and sample applicability individually.

Candidate solutions for this task

2 candidates · Compare up to three
RX Solutions

Three-dimensional CT and layer localization

The official information describes three-dimensional CT for electronics and semiconductors, including solder voids and internal structures.

Required inputs, limitations and sources

Required inputs
Co-registered 2D/3D images and segmentation uncertainty；Bond-layer thickness, heat-source distribution and material thermal parameters；Thermal tests at the same power and cooling boundaries with a known-good control

Main limitations
Confirm bond-layer contrast, resolution, service availability and segmentation error.；Detection and three-dimensional reconstruction do not establish a thermal-risk threshold. Sample size, metal artifacts and effective resolution still require validation.

RX Solutions · View source ↗
Official technical summary reviewed · Detection and three-dimensional reconstruction do not establish a thermal-risk threshold. Sample size, metal artifacts and effective resolution still require validation.

View manufacturer information ↗
Lumafield

Electronics CT and porosity-quantification route

The official information describes three-dimensional inspection of electronic assemblies and quantification of solder-joint porosity.

Required inputs, limitations and sources

Required inputs
Co-registered 2D/3D images and segmentation uncertainty；Bond-layer thickness, heat-source distribution and material thermal parameters；Thermal tests at the same power and cooling boundaries with a known-good control

Main limitations
Electronics/BGA capability does not establish resolution of microbumps or arbitrary die-attach structures.；Do not extrapolate electronics/BGA inspection to microbumps or hybrid bonding. The effect of voids on this package's thermal resistance has not been established.

Lumafield · View source ↗
Official technical summary reviewed · Do not extrapolate electronics/BGA inspection to microbumps or hybrid bonding. The effect of voids on this package's thermal resistance has not been established.

View manufacturer information ↗
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What expertise does this task need?

CT metrology and image-analysis specialist

Deliverables to discuss: Three-dimensional void/location data with traceable resolution and artifacts

No public independent-expert profile currently matches this task. Prepare the engagement scope or ask candidate suppliers for the technical specialist responsible for this work.

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Check scope and related problems

Is void area percentage sufficient for this product's acceptance decision, or are three-dimensional distribution and paired thermal tests needed?

In scope: Three-dimensional quantification of existing voids and paired thermal-risk studies；Suitability of acceptance metrics and inspection methods

Other situations: Deriving a universal acceptance percentage directly from CT；Classifying silver-sinter microporosity and macroscopic voids as the same defect；Claiming that no detection proves complete absence of voids

Initial die-attach voids and incomplete coverage →Rising thermal resistance during power cycling →Densification window for silver-sintered attachment →
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Additional supplier candidates · 6

Potential uses from public research. These entries are outside the condition-based assessment; confirm sample, specification and service requirements.

Research candidate · suitability unconfirmed

LX9200 3D X-ray inspection

Unicomp

Quantify 3D location and shape of existing solder/adhesive voids.

Sources and limits

Pair CT with thermal tests; sample-dependent resolution cannot yield a universal acceptance percentage.

Official public page; sample suitability remains unconfirmed.

Research checked: 2026-10-15

Sources and limits ↗
Solution details →
Research candidate · suitability unconfirmed

iX7059 Module Inspection

Viscom SE

Quantify 3D location and shape of existing solder/adhesive voids.

Sources and limits

Pair CT with thermal tests; sample-dependent resolution cannot yield a universal acceptance percentage.

Official search index; confirm the full page and specifications.

Research checked: 2026-10-15

Sources and limits ↗
Solution details →