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Current problemWhy can the same void percentage imply different thermal risks?
Additional supplier candidates · 6

Potential uses from public research. These entries are outside the condition-based assessment; confirm sample, specification and service requirements.

Research candidate · suitability unconfirmed

LX9200 3D X-ray inspection

Unicomp

Quantify 3D location and shape of existing solder/adhesive voids.

Sources and limits

Pair CT with thermal tests; sample-dependent resolution cannot yield a universal acceptance percentage.

Official public page; sample suitability remains unconfirmed.

Research checked: 2026-10-15

Sources and limits ↗
Solution details →
Research candidate · suitability unconfirmed

iX7059 Module Inspection

Viscom SE

Quantify 3D location and shape of existing solder/adhesive voids.

Sources and limits

Pair CT with thermal tests; sample-dependent resolution cannot yield a universal acceptance percentage.

Official search index; confirm the full page and specifications.

Research checked: 2026-10-15

Sources and limits ↗
Solution details →
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Engineering conditions

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For “Three-dimensional void distribution and thermal-risk assessment”, add details that may change the assessment order and check the basis and limits of each candidate.

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Engineering conditions

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01
Obtain a resolvable three-dimensional void distribution

Prepare first: Is the following available: Co-registered 2D/3D images and segmentation uncertainty?

To confirm:Is the following available: Co-registered 2D/3D images and segmentation uncertainty?
Conditions unconfirmed
02
Pair thermal tests and models for the same sample

Prepare first: Is the following available: Bond-layer thickness, heat-source distribution and material thermal parameters?

To confirm:Is the following available: Bond-layer thickness, heat-source distribution and material thermal parameters?
Conditions unconfirmed
03
Establish product-specific acceptance criteria

Prepare first: Is the following available: Thermal tests at the same power and cooling boundaries with a known-good control?

To confirm:Is the following available: Thermal tests at the same power and cooling boundaries with a known-good control?
Conditions unconfirmed

candidate solutions

Assessment with your current conditions

Assessment order does not indicate endorsement or performance

The order changes only with conditions you confirm. Public information cannot establish suitability for your actual samples.

BLNKK editorial notes

Current assessment and next steps

Based on reported conditions and public sources. Ready to assess does not establish sample applicability or root cause. Order does not identify the best solution.

Known conditions · 0

    Key unknowns · 3

    • Is the following available: Co-registered 2D/3D images and segmentation uncertainty?With this information, prepare a technical inquiry for “Obtain a resolvable three-dimensional void distribution”.
    • Is the following available: Bond-layer thickness, heat-source distribution and material thermal parameters?With this information, prepare a technical inquiry for “Pair thermal tests and models for the same sample”.
    • Is the following available: Thermal tests at the same power and cooling boundaries with a known-good control?With this information, prepare a technical inquiry for “Establish product-specific acceptance criteria”.

    Paths to assess

    More conditions needed

    Obtain a resolvable three-dimensional void distribution

    Prepare first: Is the following available: Co-registered 2D/3D images and segmentation uncertainty?

    • Is the following available: Co-registered 2D/3D images and segmentation uncertainty?
    Conditions that change this path
    • Is the following available: Co-registered 2D/3D images and segmentation uncertainty?Supports assessment: Data available
    More conditions needed

    Pair thermal tests and models for the same sample

    Prepare first: Is the following available: Bond-layer thickness, heat-source distribution and material thermal parameters?

    • Is the following available: Bond-layer thickness, heat-source distribution and material thermal parameters?
    Conditions that change this path
    • Is the following available: Bond-layer thickness, heat-source distribution and material thermal parameters?Supports assessment: Data available

    What to do next

    No result provided. Clarify key conditions before arranging an assessment.

    1. Is the following available: Co-registered 2D/3D images and segmentation uncertainty?

    What to prepare

    • Co-registered 2D/3D images and segmentation uncertainty; Bond-layer thickness, heat-source distribution and material thermal parameters; Thermal tests at the same power and cooling boundaries with a known-good control

    Questions to discuss

    • Co-registered 2D/3D images and segmentation uncertainty
    • Bond-layer thickness, heat-source distribution and material thermal parameters

    Public references

    RX Solutions · RX Solutions · Official information ↗Detection and three-dimensional reconstruction do not establish a thermal-risk threshold. Sample size, metal artifacts and effective resolution still require validation.

    Lumafield · Lumafield · Official information ↗Do not extrapolate electronics/BGA inspection to microbumps or hybrid bonding. The effect of voids on this package's thermal resistance has not been established.

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    Related solutions

    2 candidate solutions

    Grouped by purpose. The order does not indicate endorsement, performance or sample suitability.
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    01
    Obtain a resolvable three-dimensional void distributionPublic capability information; project scope and configuration require confirmationCompiled by BLNKK from public sources

    Three-dimensional CT and layer localization

    RX Solutions

    The official information describes three-dimensional CT for electronics and semiconductors, including solder voids and internal structures.

    Basis: The official information describes three-dimensional CT for electronics and semiconductors, including solder voids and internal structures.
    RX Solutions：RX Solutions · Official information ↗
    Check prerequisites, exclusions and catalogue relationships
    Relationship to the solution catalogueCatalogue entry pending

    The reviewed public information describes a workflow. It has not been linked to a specific product in the BLNKK solution catalogue.

    Sample or process prerequisites
    • Co-registered 2D/3D images and segmentation uncertainty
    • Bond-layer thickness, heat-source distribution and material thermal parameters
    • Thermal tests at the same power and cooling boundaries with a known-good control
    Exclusions
    • Confirm bond-layer contrast, resolution, service availability and segmentation error.
    • Detection and three-dimensional reconstruction do not establish a thermal-risk threshold. Sample size, metal artifacts and effective resolution still require validation.
    Primary sources behind these assessmentsRX Solutions：RX Solutions · Official information ↗
    View related Q&ANew note →
    02
    Obtain a resolvable three-dimensional void distributionPublic capability information; project scope and configuration require confirmationCompiled by BLNKK from public sources

    Electronics CT and porosity-quantification route

    Lumafield

    The official information describes three-dimensional inspection of electronic assemblies and quantification of solder-joint porosity.

    Basis: The official information describes three-dimensional inspection of electronic assemblies and quantification of solder-joint porosity.
    Lumafield：Lumafield · Official information ↗
    Check prerequisites, exclusions and catalogue relationships
    Relationship to the solution catalogueCatalogue entry pending

    The reviewed public information describes a workflow. It has not been linked to a specific product in the BLNKK solution catalogue.

    Sample or process prerequisites
    • Co-registered 2D/3D images and segmentation uncertainty
    • Bond-layer thickness, heat-source distribution and material thermal parameters
    • Thermal tests at the same power and cooling boundaries with a known-good control
    Exclusions
    • Electronics/BGA capability does not establish resolution of microbumps or arbitrary die-attach structures.
    • Do not extrapolate electronics/BGA inspection to microbumps or hybrid bonding. The effect of voids on this package's thermal resistance has not been established.
    Primary sources behind these assessmentsLumafield：Lumafield · Official information ↗
    View related Q&ANew note →

    Missing evidence and suitability conditions

    • Confirm sample-specific project scope, lead time and pricing with the provider.
    • For tasks without supporting sources, prepare an inquiry scope first; do not extend supplier capabilities by assumption.

    References

    2 manufacturer or institutional sources

    Expand reviewed sources and limitations
    01
    Manufacturer technical informationRX Solutions · Official informationRX Solutions · Reviewed 2026-10-14

    The official information describes three-dimensional CT for electronics and semiconductors, including solder voids and internal structures.

    Limit: Detection and three-dimensional reconstruction do not establish a thermal-risk threshold. Sample size, metal artifacts and effective resolution still require validation.
    02
    Manufacturer technical informationLumafield · Official informationLumafield · Reviewed 2026-10-14

    The official information describes three-dimensional inspection of electronic assemblies and quantification of solder-joint porosity.

    Limit: Do not extrapolate electronics/BGA inspection to microbumps or hybrid bonding. The effect of voids on this package's thermal resistance has not been established.

    Before assessment

    Questions to ask before assessment

    Expand assessment checklist
    1. Co-registered 2D/3D images and segmentation uncertainty
    2. Bond-layer thickness, heat-source distribution and material thermal parameters
    3. Thermal tests at the same power and cooling boundaries with a known-good control
    View related technical Q&A →
    BLNKK editorial notes

    Related technical Q&A

    • Is void area percentage sufficient for this product's acceptance decision, or are three-dimensional distribution and paired thermal tests needed?
    • Compare two-dimensional projections and three-dimensional void distributions for the same sample
    View related technical Q&A →