Xslicer SMX microfocus CT
Shimadzu 島津 · Measurement and inspection
Research candidate · suitability unconfirmed
Official public page; sample suitability remains unconfirmed.
Research checked: 2026-10-15- Purpose
- Potential engineering use: [Flip-chip solder bridging] Compare placement/reflow conditions with bridge locations. [3D void topology and thermal risk] Quantify 3D location and shape of existing solder/adhesive voids.
- Technical approach
- Detailed mechanism and process conditions are not documented here. Confirm with the supplier.
- Scope of use
- Potential engineering use: [Flip-chip solder bridging] Compare placement/reflow conditions with bridge locations. [3D void topology and thermal risk] Quantify 3D location and shape of existing solder/adhesive voids.
- Limitations and open questions
- [Flip-chip solder bridging] Verify solder volume, pitch and electrical results; board-level BGA results are not direct flip-chip evidence. [3D void topology and thermal risk] Pair CT with thermal tests; sample-dependent resolution cannot yield a universal acceptance percentage. Supplier confirmation of samples, specifications and service availability is required; improvement has not been demonstrated. Confirm resolution, material contrast and visibility of the die-attach layer.
- Public evidence
- The official source lists Xslicer SMX microfocus CT.
Supporting references
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
Potential uses by engineering problem
Solder bridging after flip-chip reflow
Compare placement/reflow conditions with bridge locations.
Verify solder volume, pitch and electrical results; board-level BGA results are not direct flip-chip evidence.
View engineering problem →Why can the same void percentage imply different thermal risks?
Quantify 3D location and shape of existing solder/adhesive voids.
Pair CT with thermal tests; sample-dependent resolution cannot yield a universal acceptance percentage.
View engineering problem →BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.