SN-90 silicon nitride substrates
MARUWA · Materials and interfaces
Research candidate · suitability unconfirmed
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Research checked: 2026-10-15- Purpose
- Potential engineering use: [Initial thermal path through metallized ceramic substrates] Compare the initial path through ceramic, metallization and layer thicknesses.
- Technical approach
- Detailed mechanism and process conditions are not documented here. Confirm with the supplier.
- Scope of use
- Potential engineering use: [Initial thermal path through metallized ceramic substrates] Compare the initial path through ceramic, metallization and layer thicknesses.
- Limitations and open questions
- [Initial thermal path through metallized ceramic substrates] Use the actual metallized stack, contacts and normalized tests; bare-ceramic conductivity is not substrate thermal resistance. Supplier confirmation of samples, specifications and service availability is required; improvement has not been demonstrated.
- Public evidence
- The official source lists SN-90 silicon nitride substrates.
Supporting references
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Potential uses by engineering problem
Should the power substrate change its ceramic, thickness or copper layers?
Compare the initial path through ceramic, metallization and layer thicknesses.
Use the actual metallized stack, contacts and normalized tests; bare-ceramic conductivity is not substrate thermal resistance.
View engineering problem →BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.