FOX-XP wafer, bare-die and module burn-in and test
Aehr Test Systems · Reliability qualification and failure analysis
- Purpose
- Wafers, singulated dies and modules may develop electrical drift or failures under electrical and thermal stress. Controlled stress and defined test coverage help distinguish device changes from contact or test errors.
- Technical approach
- FOX-XP uses WaferPak or DiePak contactor/carrier configurations to combine functional testing, BIST/DFT and burn-in stress, with channel voltage/current resources and protection.
- Scope of use
- Aehr lists logic, memory, photonic and power devices, with wafer, panel, die and module configurations. Available bias, temperature, power and test modes depend on the DUT, contactor and system configuration.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsSystem power, contactor capacity and channel maxima should not be assumed to apply simultaneously to one configuration. Burn-in can expose or screen electrical failures, but does not independently identify a physical root cause or guarantee reliability or yield.
What to prepareBLNKK suggests preparing DUT form, pins and contact carrier, test patterns or BIST, failure criteria, electrical baselines, bias/current/temperature/duration profiles and checks for contact or stress errors.
Confirm with the supplierConfirm DUT/contactor compatibility, test coverage and electrical resources, power configuration and how actual junction temperature is measured. Also confirm failure logging, contact checks and whether optional automatic alignment is needed.
- Public evidence
- The page and FOX-XP Rev C brief list up to 18 WaferPak or nine DiePak blades and system capacity up to 3500 W per wafer. The page separately lists WaferPak contactor capacity up to 2 kW; these ratings require configuration-specific confirmation.
Supporting references
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.