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Aehr Test Systems

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Public capability summary

  • Wafer-level burn-in and reliability test for power and silicon carbide
Reliability validation and failure analysisProcess equipment and window controlPackage structures and deformation compensation

Applications: logic / memory / photonic / power wafers, dies and modules

Catalog solutions · 1

Reliability qualification and failure analysis

FOX-XP wafer, bare-die and module burn-in and test

Wafers, singulated dies and modules may develop electrical drift or failures under electrical and thermal stress. Controlled stress and defined test coverage help distinguish device changes from contact or test errors.

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