T-RECS low-CTE coreless organic interposer
TOPPAN · Package architecture and warpage compensation
- Purpose
- Thermal-expansion mismatch between interposer and substrate can increase RDL interface stress in multi-die packages. T-RECS offers a coreless organic-interposer architecture for heterogeneous integration and thermomechanical design comparisons.
- Technical approach
- Low-CTE organic resin reinforces fine-line RDLs, combined with a coreless structure and narrow-pitch through-mold vias. Carrier separation enables standalone electrical testing, supporting the known-good-substrate supply concept.
- Scope of use
- The architecture targets multi-die/chiplet integration and large packages. The official page lists structures and target specifications; available sizes, layers, routing rules and assembly conditions require development-program confirmation.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsPublished architecture/development targets are not production design rules or reliability qualifications. Low CTE and electrical testing alone do not guarantee low package warp, crack-free operation or assembly yield.
What to prepareBLNKK recommends preparing die layout, I/O/bandwidth needs, substrate/interposer geometry, RDL/TMV requirements and assembly thermal histories. Include existing crack, warp and electrical data to compare architectures and validation plans.
Confirm with the supplierConfirm sampling/co-development status, current dimensions/design rules, CTE temperature/reference conditions and electrical-test coverage. Discuss assembly and moisture/thermal-cycle qualification, distinguishing targets from available specifications.
- Public evidence
- The supplier publishes T-RECS structure/targets and describes CTE approximately 45% below conventional packaging substrates. The complete comparison/test basis is not specified, so this does not establish warp or crack improvement in a customer package.
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.