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Public capability summary

  • T-RECS low-CTE coreless organic interposer · Package architecture and warpage compensation
  • TOPPAN FC-BGA substrate design and manufacturing · Package architecture and warpage compensation
Package structures and deformation compensationMaterial properties and interface designReliability validation and failure analysis

Applications: Chiplets, multi-die, large packages and FC-BGA · FC-BGA substrate/ball-formation evaluation

Catalog solutions · 2

Package architecture and warpage compensation

T-RECS low-CTE coreless organic interposer

Thermal-expansion mismatch between interposer and substrate can increase RDL interface stress in multi-die packages. T-RECS offers a coreless organic-interposer architecture for heterogeneous integration and thermomechanical design comparisons.

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Use the electronics form for package substrates and semiconductor solutions, specifying the product, application and requirements. The Taiwan phone routes through the electronics company; the Shanghai phone provides group routing. Official source ↗

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