CLIP chip-last panel-level fan-out packaging

Powertech Technology Inc. (PTI) · Package architecture and warpage compensation

Purpose: Integrating valuable or thermally sensitive dies before RDL processing can expose them to downstream fabrication losses. CLIP offers a chip-last alternative using known-good RDL.
Technical approach: RDL is formed before die integration, allowing assembly with known-good routing. PTI lists embedded passives and integration of three or more dies; the actual stack and assembly sequence need design-specific review.
Scope of use: CLIP applications include CPU, GPU, FPGA and thermally sensitive devices; actual routing and stack rules depend on the design.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
It cannot reposition embedded dies or guarantee elimination of warpage or yield loss. Published capabilities do not qualify every design.
What to prepare
BLNKK suggests current flow/shift data, die and pin layouts, RDL design, conversion costs and a validation plan.
Confirm with the supplier
Confirm design rules, known-good RDL criteria, assembly sequence and stack-specific warpage/reliability evidence.
Public evidence: The current CLIP page states minimum RDL L/S≥2/2µm; the January 2022 investor presentation also describes known-good RDL integration.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.