CLIP chip-last panel-level fan-out packaging
Integrating valuable or thermally sensitive dies before RDL processing can expose them to downstream fabrication losses. CLIP offers a chip-last alternative using known-good RDL.
Powertech Technology Inc. (PTI)
Explore the supplier’s public information and its documented technical solutions.
View contact information ↓Public capability summary
- CLIP chip-last panel-level fan-out packaging · Package architecture and warpage compensation
- PTI FCCSP/FCBGA flip-chip assembly services · Process equipment and thermal control
Applications: CPU / GPU / FPGA / thermally sensitive devices / multi-die · Flip-chip bridge comparison builds · Wafer bump formation comparison
Catalog solutions · 3
PTI FCCSP/FCBGA flip-chip assembly services
Compare flip-chip assembly conditions using actual bump/pad geometry to investigate solder bridging.
PTI wafer bumping services
Bump-height assessment needs defined formation targets and comparisons across wafer locations.
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Public sources
Contact information
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Select Sales Services in the official form for packaging and testing inquiries. Official source ↗
Taiwan · Supplier office · Sales inquiries
Powertech Technology Inc. — Sales Service
- info@pti.com.tw
- Phone
- +886 3 5980300
Official source ↗Source checked
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