TS9001 high-resolution TDR fault localization for advanced packages

Advantest · Reliability qualification and failure analysis

Purpose: Non-destructively narrows the search for package-interconnect opens or shorts before physical analysis.
Technical approach: Short-pulse TDR compares good and failed-device reflections to estimate fault distance; CAD mapping is optional.
Scope of use: Sales have ended; support for existing equipment requires confirmation. Historical applications include flip-chip BGA, WLP and 2.5D/3D IC.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Sales have ended; new supply and support cannot be assumed. Requires an electrically accessible network and suitable reference; resolution is not universal location accuracy.
What to prepare
BLNKK suggests failed/good samples, routing geometry/dielectric data, probe access and failure conditions to preserve.
Confirm with the supplier
Confirm maintenance, calibration, probe/software compatibility and available follow-up analysis or alternative services.
Public evidence: The current discontinued list and its November 2023 catalog mark TS9001 as sales ended. The catalog specifies <5 µm fault-area resolution over 0–800 ps and 30 seconds per point for 1,024 averages, excluding probe touchdown. These are not universal location accuracy or total test time.

Supporting references

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