TS9001 high-resolution TDR fault localization for advanced packages
Non-destructively narrows the search for package-interconnect opens or shorts before physical analysis.
Advantest
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- ATE · system-level test · thermal and reliability test solutions
Applications: Flip-chip BGAs, WLP, interposers and 2.5D/3D ICs · Observable SoC/chiplet interfaces
Catalog solutions · 2
V93000 EXA Scale electrical testing of observable device interfaces
Compare observable device responses under repeatable conditions to investigate temperature-dependent errors.
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Taiwan · Supplier office
Advantest Taiwan Inc.
- Phone
- +886 3 659 3666
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