XP8 DCM PECVD dielectric deposition
Dielectric films for hybrid bonding and advanced packaging need compatible thermal budgets, interface properties and stress. Deposition should be assessed with downstream planarization, cleaning and bonding.
ASM International
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- Atomic layer deposition and advanced interconnect process equipment
Applications: Hybrid bonding / dielectric films
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Japan · Supplier office
ASM Japan — Tokyo
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- +81 42 337 6311
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