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COMSOL

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Public capability summary

  • Coupled thermal, structural and electromagnetics multiphysics
Simulation, modelling and life predictionPackage structures and deformation compensationReliability validation and failure analysis

Applications: Package R&D and multiphysics mechanism analysis

Catalog solutions · 1

Thermo-mechanical simulation and lifetime prediction

COMSOL Multiphysics for semiconductor packaging

Study coupled thermal, structural, fluid and electromagnetic effects in packages to compare warpage, stress and cooling trade-offs. The approach fits problems where a single-physics model omits relevant interactions.

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