FINEPLACER sigma precision die bonding
Research assemblies require comparison of die alignment, joining materials and process conditions. FINEPLACER sigma provides a configurable precision die/flip-chip bonding platform.
Finetech
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View contact information ↓Public capability summary
- Sub-micron die bonding · flip chip · rework and process development
Applications: Precision die assembly / package prototypes · PCB-mounted BGA / SMD
Catalog solutions · 2
FINEPLACER core plus BGA/SMD rework
Compare controlled BGA/SMD desoldering, residual-solder removal and reassembly when investigating joint failures.
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Public sources
Contact information
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United States · Supplier office
Finetech USA/West — Chandler Office
- Phone
- +1 480 893 1630
Official source ↗Source checked
Mainland China · General contact
Finetech China — Guangdong Power Technology Co., Ltd.
- Phone
- +86 769 2805 6381
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Germany · Headquarters
Finetech GmbH & Co. KG — Berlin Headquarters
- finetech@finetech.de
- Phone
- +49 30 936681 0
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More regional contacts (1)
United States · Supplier office
Finetech USA/East — Amherst Office
- Phone
- +1 603 627 8989
Official source ↗Source checked
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.