VGSTUDIO MAX industrial CT void analysis
Existing CT scans need consistent segmentation to locate voids in the intended bond layer or region and quantify their position, volume and distribution.
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View contact information ↓Applications: Electronics / material CT datasets · Measured bump/batch datasets
Existing CT scans need consistent segmentation to locate voids in the intended bond layer or region and quantify their position, volume and distribution.
Bump-height grading needs distributions, sampling and agreed acceptance windows, rather than batch averages alone.
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