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Koh Young Technology

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Public capability summary

  • 3D optical inspection · solder and assembly process analytics
Measurement, inspection and failure localizationProcess equipment and window controlReliability validation and failure analysis

Applications: Micro-solder, flux, bumps and high-density substrates · Die-position measurement preparation · Underfill edge and keepout inspection

Catalog solutions · 3

Candidates in engineering problem guides

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Contact information

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The General Inquiry form accepts sales-related and other inquiries. It excludes technical support and investor relations, which have separate official channels. The reviewed Taiwan branch listing publishes an email address but no phone number. Official source ↗

More regional contacts (1)

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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.