ICROS wafer back-grinding protection tape
Wafer back-grinding needs front-side and bump protection, with support, handling and tape-removal conditions evaluated after thinning.
Mitsui Chemicals
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- Semiconductor process tapes · films · packaging and thermal materials
Applications: Silicon wafer thinning / back-grinding
Catalog solutions · 1
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Use the Taiwan form for general inquiries and confirm the team responsible for a specific film or tape. For general inquiries in mainland China, use the listed information mailbox. Official source ↗
United States · Supplier office
Mitsui Chemicals America, Inc. — Head Office, White Plains
- Phone
- +1 914 253 0777
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Taiwan · Supplier office
Taiwan Mitsui Chemicals, Inc. — General Inquiries
- Phone
- +886 2 2361 7887
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Mainland China · General contact
Mitsui Chemicals — Mainland China Official Website Inquiry Contact
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Japan · Headquarters
Mitsui Chemicals, Inc. — General Inquiries
- Phone
- +81 3 6880 7500
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