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Asia Neo Tech

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Process equipment

NHOV semiconductor vacuum oven

Potential engineering use: [Moisture/reflow-induced package delamination] Study delamination using moisture history and matched pre/post-reflow interfaces.

Research candidate · suitability unconfirmed

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Research checked: 2026-10-15

Potential uses by engineering problem

New delamination after reflow in moisture-exposed packages

Study delamination using moisture history and matched pre/post-reflow interfaces.

Record conditioning, drying and reflow; one acoustic image cannot establish defect timing.

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