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CoorsTek

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Materials and interfaces

Thin/thick-film ceramic substrates

Potential engineering use: [Initial thermal path through metallized ceramic substrates] Compare the initial path through ceramic, metallization and layer thicknesses.

Research candidate · suitability unconfirmed

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Research checked: 2026-10-15

Potential uses by engineering problem

Should the power substrate change its ceramic, thickness or copper layers?

Compare the initial path through ceramic, metallization and layer thicknesses.

Use the actual metallized stack, contacts and normalized tests; bare-ceramic conductivity is not substrate thermal resistance.

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