CT 450G configurable optical metrology
Potential engineering use: [Cooling-stage warpage reversal in large 2.5D FCBGA] Compare material, stack and thermal-history effects on cooling curvature. [Package solder-ball coplanarity] Compare external solder-ball heights and initial contact. [Microbump height variation and coplanarity] Compare bump fabrication or 3D height data.
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Research checked: 2026-10-15Potential uses by engineering problem
Warpage reversal during cooling in large 2.5D FCBGA packages
Compare material, stack and thermal-history effects on cooling curvature.
Require heating/cooling data, cure shrinkage and viscoelastic properties; room-temperature flatness does not establish reversal behavior.
View engineering problem →Package solder-ball coplanarity and initial contact
Compare external solder-ball heights and initial contact.
Distinguish package balls from internal microbumps; avoid fixture-induced flattening.
View engineering problem →Microbump height variation and coplanarity
Compare bump fabrication or 3D height data.
Verify pitch, reflectivity, reference plane and repeatability; fabrication does not establish coplanarity compliance.
View engineering problem →