5200TN solder wettability testing
Suspected solder, electrode-surface or exposure effects call for wettability comparison.
RHESCA
Explore the supplier’s public information and its documented technical solutions.
View contact information ↓Public capability summary
- Provides instruments for electronic bonding, wetting, adhesion and thermal-material testing.
Other names: RHESCA CO., LTD. · 株式会社レスカ
Applications: Solder and electrode wetting · Wire and bond strength comparison · Adhesive placement-condition comparison · TIM material comparison
Catalog solutions · 4
PTR1102 wire-pull and bond-shear testing
Wire, ball or die-bond strength needs comparison alongside failure locations.
TAC2000 adhesive probe-tack testing
Compare initial tack and separation behavior under defined adhesive contact conditions.
TCM1001 steady-state thermal-material testing
TIM-material comparison needs heat transport tested at matched thickness, pressure and temperature.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- TCM1001 steady-state thermal-material testing · Uneven heat-spreader contact and local hot spots in multi-die packages →
- 5200TN solder wettability testing · BGA head-in-pillow open joints →
- PTR1102 wire-pull and bond-shear testing · Power wire-bond lift-off and heel fatigue →
- TAC2000 adhesive probe-tack testing · Heat-spreader seal adhesion and cure →
Public sources
Contact information
Contact the supplier directly through its official channels.
The Japanese product inquiry form covers bond-strength, solder-wetting, film-adhesion and thermal-conductivity testers, as well as contract measurements. The listed phone reaches Hino headquarters. Equipment repairs have a separate inquiry entry. Official source ↗
Japan · Headquarters
RHESCA Co., Ltd. — Hino Headquarters
- Phone
- +81 42 582 4711
Official source ↗Source checked
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