nano3DX 3D X-ray sampling of substrate copper-fill voids

Rigaku · Engineering measurement and characterization

Purpose: Copper-fill voids can occur at different substrate depths; 3D imaging complements individual cross-sections.
Technical approach: nano3DX combines parallel-beam X-rays, optical magnification and CT reconstruction, with specimen-appropriate targets and settings.
Scope of use: Substrates or coupons need adequate penetration/contrast and suitable dimensions and rotation clearance.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Metal thickness and settings affect penetration/contrast. Voxel size is not defect-detection size; images do not establish electrical continuity or chemical identity.
What to prepare
BLNKK suggests preparing stack-up, copper thickness, specimen dimensions, suspected void locations/sizes and representative samples for section correlation.
Confirm with the supplier
Confirm targets, field of view, acquisition/reconstruction, defect recognition and repeatability; discuss correlation with cross-sections.
Public evidence: Rigaku describes the imaging method; its 2019 journal article demonstrates internal electronic-component and PCB imaging.

Supporting references

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