SmartLab SE XRD analysis of thin-film residual stress and texture
Metal films can retain deposition/cooldown stress; lattice strain and texture data complement visible shape measurements.
Rigaku
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- X-ray diffraction, imaging and materials analysis
Applications: RDL, UBM, metallization and coatings · Substrate copper interconnect coupons · Metal films / process coupons · Resin / mold-compound coupons
Catalog solutions · 4
nano3DX 3D X-ray sampling of substrate copper-fill voids
Copper-fill voids can occur at different substrate depths; 3D imaging complements individual cross-sections.
NEX CG II multilayer metal-film analysis
Contact- or seed-layer process comparisons need film-thickness and elemental-composition data alongside other evidence.
STAvesta simultaneous mass-loss / thermal analysis
Drying comparisons need separate observations of mass change and thermal reactions.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- SmartLab SE XRD analysis of thin-film residual stress and texture · Cracking and intermittent opens in fine-line RDL after thermal cycling →
- STAvesta simultaneous mass-loss / thermal analysis · New delamination after reflow in moisture-exposed packages →
- NEX CG II multilayer metal-film analysis · High initial RDL via contact resistance →
- nano3DX 3D X-ray sampling of substrate copper-fill voids · Internal voids in substrate microvia copper fill →
Public sources
- Product information: SmartLab SE XRD analysis of thin-film residual stress and texture
- Technical reference: XRD 2001: Orientation and residual-stress evaluation in metal thin films (PDF)
- Public reference: applications/xrd/b-xrd3005
- Product information: nano3DX 3D X-ray sampling of substrate copper-fill voids
- Product information: NEX CG II multilayer metal-film analysis
- Product information: STAvesta simultaneous mass-loss / thermal analysis
Contact information
Contact the supplier directly through its official channels.
The Taiwan office page lists semiconductor products. Specify the instrument for other X-ray, materials or thermal analysis inquiries to confirm the local responsible team. Official source ↗
United States · Supplier office
Rigaku Americas
- info@rigaku.com
- Phone
- +1 281 3622300
Official source ↗Source checked
Taiwan · Supplier office
Rigaku Technology Taiwan Co., Ltd.
- rtc.tw@rigaku.com
- Phone
- +886 3 5530225
Official source ↗Source checked
Mainland China · Supplier office
Rigaku Shanghai Corporation (RSHC)
- Info@rigaku.com.cn
- Phone
- +86 21 60741316
Official source ↗Source checked
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