AEC-Q104 acoustic/DPA inspection
FALAB · Measurement and inspection
Research candidate · suitability unconfirmed
Official search index; confirm the full page and specifications.
Research checked: 2026-10-15- Purpose
- Potential engineering use: [Moisture/reflow-induced package delamination] Study delamination using moisture history and matched pre/post-reflow interfaces. [Brittle fracture at solder/IMC interfaces] Use shear, sections and fracture analysis to distinguish failure locations.
- Technical approach
- Detailed mechanism and process conditions are not documented here. Confirm with the supplier.
- Scope of use
- Potential engineering use: [Moisture/reflow-induced package delamination] Study delamination using moisture history and matched pre/post-reflow interfaces. [Brittle fracture at solder/IMC interfaces] Use shear, sections and fracture analysis to distinguish failure locations.
- Limitations and open questions
- [Moisture/reflow-induced package delamination] Record conditioning, drying and reflow; one acoustic image cannot establish defect timing. [Brittle fracture at solder/IMC interfaces] Retain loading conditions and fracture location; strength alone does not identify brittle IMC failure. Supplier confirmation of samples, specifications and service availability is required; improvement has not been demonstrated.
- Public evidence
- The official source lists AEC-Q104 acoustic/DPA inspection.
Supporting references
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
Potential uses by engineering problem
New delamination after reflow in moisture-exposed packages
Study delamination using moisture history and matched pre/post-reflow interfaces.
Record conditioning, drying and reflow; one acoustic image cannot establish defect timing.
View engineering problem →Brittle fracture at solder IMC interfaces
Use shear, sections and fracture analysis to distinguish failure locations.
Retain loading conditions and fracture location; strength alone does not identify brittle IMC failure.
View engineering problem →BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.