EMIB local-silicon-bridge 2.5D multi-die packaging
Multi-die AI, HPC and networking systems need dense die-to-die links. EMIB provides a local silicon-bridge 2.5D architecture to compare with other integration approaches.
Intel Foundry
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- EMIB local-silicon-bridge 2.5D multi-die packaging · Package architecture and warpage compensation
- Foveros Direct 3D chiplet integration with Cu-to-Cu hybrid bonding · Package architecture and warpage compensation
Applications: Logic and HBM integration for AI, HPC and networking · AI/HPC, data center, client and 3D chiplets
Catalog solutions · 2
Foveros Direct 3D chiplet integration with Cu-to-Cu hybrid bonding
AI/HPC multi-die systems need dense vertical links alongside power, cooling, stack-up and bond-reliability assessment.
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Public sources
- Product information: Foveros Direct 3D chiplet integration with Cu-to-Cu hybrid bonding
- Technical reference: Intel Foundry EMIB technology brief (July 2025) (PDF)
- Public reference: content/www/us/en/corporate/usa-chipmaking/news-and-resources/video-intel-emib-technology-explained.html
- Public reference: content/dam/www/central-libraries/us/en/documents/2025-07/foveros-25d-product-brief.pdf
Contact information
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Intel Foundry — Business Development / Global Inquiries
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