Chiplet PHY Designer 2025 interconnect simulation
Before tapeout, die-to-die links need signal-quality and margin evaluation. Chiplet PHY Designer 2025 compares D2D links using PHY and channel models.
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View contact information ↓Other names: Keysight · 是德科技
Applications: Chiplet / die-to-die links · Accessible power rails · Contactable TSV / insulation test structures · Kelvin via and redistribution test structures · Interposers and passive test structures · CPO / fiber-attach optical-power comparisons
Before tapeout, die-to-die links need signal-quality and margin evaluation. Chiplet PHY Designer 2025 compares D2D links using PHY and channel models.
Measure noise, ripple and load transients on accessible DC rails to compare waveforms and events.
Leakage in TSV or insulation test structures requires bias/current comparisons and measurement-validity checks.
Evaluate contact or interconnect resistance while reducing errors contributed by test leads.
Suspected interconnect crosstalk calls for comparing transmission, reflection and coupling across accessible test structures.
Record optical power during position, temperature or attachment-process changes for fiber-attach loss and thermal-drift comparisons.
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
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Taiwan · Supplier office · Sales inquiries
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Mainland China · Supplier office · Sales inquiries
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