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Wintech Nano (Suzhou)

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Research candidate · suitability unconfirmed

Unclaimed company profile based on public research. Supplier endorsement and project-level performance are unconfirmed.

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Catalog solutions · 3

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Measurement and inspection

Solder-joint microscopy and mechanical testing

Potential engineering use: [Brittle fracture at solder/IMC interfaces] Use shear, sections and fracture analysis to distinguish failure locations.

Research candidate · suitability unconfirmed

Official public page; sample suitability remains unconfirmed.

Research checked: 2026-10-15

Potential uses by engineering problem

Brittle fracture at solder IMC interfaces

Use shear, sections and fracture analysis to distinguish failure locations.

Retain loading conditions and fracture location; strength alone does not identify brittle IMC failure.

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Measurement and inspection

Heat-sink assembly strain measurement

Potential engineering use: [Cooling-assembly preload deformation] Compare cooling-assembly preload and package deformation.

Research candidate · suitability unconfirmed

Official public page; sample suitability remains unconfirmed.

Research checked: 2026-10-15

Potential uses by engineering problem

Does mounting the cooler deform the package?

Compare cooling-assembly preload and package deformation.

Require force, torque, contact and strain; lower temperature does not establish reduced deformation.

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Measurement and inspection

DMA/TMA/DSC packaging-material analysis

Potential engineering use: [Cooling-stage warpage reversal in large 2.5D FCBGA] Compare material, stack and thermal-history effects on cooling curvature. [RDL film/cure-induced curvature increment] Assess film and cure-material contributions to curvature increments.

Research candidate · suitability unconfirmed

Official public page; sample suitability remains unconfirmed.

Research checked: 2026-10-15

Potential uses by engineering problem

Warpage reversal during cooling in large 2.5D FCBGA packages

Compare material, stack and thermal-history effects on cooling curvature.

Require heating/cooling data, cure shrinkage and viscoelastic properties; room-temperature flatness does not establish reversal behavior.

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Which RDL layer is making the wafer bend more?

Assess film and cure-material contributions to curvature increments.

Require pre/post-film curvature, thickness and properties; indentation modulus is not residual-stress measurement.

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