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Research candidate · suitability unconfirmed

Unclaimed company profile based on public research. Supplier endorsement and project-level performance are unconfirmed.

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Catalog solutions · 2

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Measurement and inspection

Mechanical Tester nanoindentation and scratch testing

Potential engineering use: [RDL film/cure-induced curvature increment] Assess film and cure-material contributions to curvature increments.

Research candidate · suitability unconfirmed

Official public page; sample suitability remains unconfirmed.

Research checked: 2026-10-15

Potential uses by engineering problem

Which RDL layer is making the wafer bend more?

Assess film and cure-material contributions to curvature increments.

Require pre/post-film curvature, thickness and properties; indentation modulus is not residual-stress measurement.

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Measurement and inspection

Surface profiling laboratory services

Potential engineering use: [Microbump height variation and coplanarity] Compare bump fabrication or 3D height data. [TSV reveal height and backside coplanarity] Compare exposed TSV height distribution and backside topography.

Research candidate · suitability unconfirmed

Official search index; confirm the full page and specifications.

Research checked: 2026-10-15

Potential uses by engineering problem

Microbump height variation and coplanarity

Compare bump fabrication or 3D height data.

Verify pitch, reflectivity, reference plane and repeatability; fabrication does not establish coplanarity compliance.

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TSV reveal height and backside coplanarity

Compare exposed TSV height distribution and backside topography.

Confirm the backside process and measurement range; generic TSV CMP may not cover reveal.

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