S neox 6 multi-technology 3D optical surface metrology
Microbump height and coplanarity, RDL topography and local roughness need comparable height and dimensional data to support process decisions, beyond visual inspection alone.
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View contact information ↓Applications: Wafers, RDL, copper pillars and package surfaces
Microbump height and coplanarity, RDL topography and local roughness need comparable height and dimensional data to support process decisions, beyond visual inspection alone.
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