Kinex integrated die-to-wafer hybrid bonding system
Delay after surface activation, contamination and alignment drift can affect die-to-wafer hybrid-bond consistency. Multi-die stacks also require traceable process records.
Applied Materials
Explore the supplier’s public information and its documented technical solutions.
View contact information ↓Public capability summary
- Advanced packaging deposition · plating · hybrid bonding process integration
Applications: 3D IC, HBM, CPO and sensors · TSV dielectric liners · Pre-plating TSV metallization · TSV / hybrid-bond surfaces · HBM thin-die backside / carrier wafers
Catalog solutions · 5
Producer InVia TSV dielectric-liner deposition
Assess dielectric coverage through TSV depth when evaluating deposition conditions and leakage risk.
Endura Ventura TSV barrier/seed deposition
Compare TSV barrier and copper-seed coverage before electroplating, focusing on metallization continuity through deep vias.
Reflexion LK copper/dielectric CMP planarization
Assess copper/dielectric height differences in TSV planarization and hybrid-bond surfaces alongside contamination and bonding results.
Producer Avila backside dielectric stress compensation
Evaluate backside dielectric stress compensation before thin-die stacking.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- Producer Avila backside dielectric stress compensation · Warpage reversal during cooling in large 2.5D FCBGA packages →
- Reflexion LK copper/dielectric CMP planarization · Local interface voids after hybrid bonding →
- Kinex integrated die-to-wafer hybrid bonding system · Local interface voids after hybrid bonding →
- Reflexion LK copper/dielectric CMP planarization · TSV reveal height and backside coplanarity →
- Endura Ventura TSV barrier/seed deposition · Seams and voids in TSV copper fill →
- Producer InVia TSV dielectric-liner deposition · Leakage localization in TSV insulating liners →
Public sources
- Product information: Kinex integrated die-to-wafer hybrid bonding system
- Public reference: content/dam/site/prod-tech/semi/doc/hybrid_bonding_scalev4.pdf.coredownload.inline.pdf
- Public reference: us/en/newsroom/media-kit-digital-assets.html
- Product information: Producer InVia TSV dielectric-liner deposition
- Product information: Endura Ventura TSV barrier/seed deposition
- Product information: Reflexion LK copper/dielectric CMP planarization
- Product information: Producer Avila backside dielectric stress compensation
Contact information
Contact the supplier directly through its official channels.
United States · Headquarters
Applied Materials, Inc.
- Phone
- +1 408 727 5555
Official source ↗Source checked
Taiwan · Supplier office
Applied Materials Taiwan, Ltd. — Hsinchu
- Phone
- +886 3 579 8888
Official source ↗Source checked
India · Supplier office
Applied Materials India Private Limited — Bangalore
- info_india@amat.com
- Phone
- +91 80 6628 3000
Official source ↗Source checked
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