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Sample measurability is confirmed. Establish the heating and cooling baseline.
Needs a full thermal history and repeatable reversal.
Complete the heating and cooling measurements for a model calibration assessment.
Navigation example
Selected paths in this example
Sample measurability is confirmed. Establish the heating and cooling baseline.
Needs a full thermal history and repeatable reversal.
Complete the heating and cooling measurements for a model calibration assessment.
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Damp heat / drying / bias / mechanical reliability
Showing 6 of 10 problems
Locate electrical anomalies in routing regions, then evaluate thermomechanical stress using stackup and material data.
Fine-line multilayer RDL conductors and vias · Thermal cycling and reliability stressConfirm new reflow damage and interface depth, then compare exposure / drying under common thermal loads. Do not assume all delamination is moisture-driven.
Mold resin / die / substrate interfaces · Moisture exposure, drying controls, and reflowFirst confirm insulation paths between conductors in an organic substrate and valid temperature-humidity-bias measurements, then distinguish fixture, surface-contamination, and internal CAF hypotheses.
Adjacent conductors and dielectric insulation paths in an organic substrate · Temperature-humidity-bias testing or insulation-resistance testingFirst confirm the TSV-to-silicon bulk topology, aggregate geometry, and low-current background, then compare liner depth and process contamination using controls that have not undergone breakdown.
Insulating liner between TSV copper and silicon · Via formation, after liner deposition or copper filling, and bias verificationFirst localize IMC / metal-interface fracture surfaces and the actual layer sequence, then control metallization, aging, and loading mode to compare materials and bonding processes.
Solder intermetallic compounds and UBM / pad interfaces · Physical analysis after assembly, thermal aging, or mechanical loadingConfirm that board-level BGA solder joints were initially formed, then compare fatigue responses using staged damage, measured specimen loads, and material and geometry controls.
Formed BGA solder joints between the package and PCB · Passive thermal cycling and board-level reliabilityTechnology directions help you explore methods. They do not establish a standard solution or sample suitability.
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