CoWoS-R RDL interposer with CTE-buffering layers
Large HPC/AI multi-die packages need dense interconnects while managing thermal-expansion mismatch and joint stress between dies, interposers and substrates.
TSMC
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- CoWoS-R RDL interposer with CTE-buffering layers · Package architecture and warpage compensation
- TSMC SoIC 3D stacking platform · Package architecture and warpage compensation
Applications: HPC/AI multi-die and HBM integration · 3D-stack TSV design review · Fan-out architecture/position-budget comparison
Catalog solutions · 3
TSMC SoIC 3D stacking platform
TSV-adjacent device review needs the actual 3D stack and supplier design rules.
TSMC InFO integrated fan-out packaging
Fan-out die-shift investigations can prompt an architecture and placement-tolerance review.
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New North American customers should expand North America and select their region to open New Customer Inquiry. The Asia contact excludes Japan and mainland China; mainland China has North, South and East China contacts. Describe foundry or advanced-packaging needs. TSMC does not sell end-user IC products; existing customers should contact their account manager. Official source ↗
United States · Supplier office · Sales inquiries
TSMC North America — Marketing and Customer Service
- Phone
- +1 408 382 8000
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Taiwan · Supplier office · Sales inquiries
TSMC Asia Business Division
- sales_asia@tsmc.com
- Phone
- +886 3 563 6688
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Mainland China · Supplier office · Sales inquiries
TSMC China Business Development — East China / Shanghai
- G_eastchina@tsmc.com
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More regional contacts (2)
Mainland China · Supplier office · Sales inquiries
TSMC China Business Development — North China
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Mainland China · Supplier office · Sales inquiries
TSMC China Business Development — South China
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